Method for Producing an Optoelectronic Semiconductor Component and Optoelectronic Semiconductor Component

In an embodiment a method includes arranging a plurality of semiconductor chips on a carrier, arranging an auxiliary carrier on sides of the semiconductor chips facing away from the carrier, removing the carrier, separating the auxiliary carrier between the semiconductor chips to form auxiliary carr...

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Hauptverfasser: Huppmann, Sophia, Geringer, Viktor, Lindberg, Gudrun, Tangring, Ivar
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Sprache:eng
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creator Huppmann, Sophia
Geringer, Viktor
Lindberg, Gudrun
Tangring, Ivar
description In an embodiment a method includes arranging a plurality of semiconductor chips on a carrier, arranging an auxiliary carrier on sides of the semiconductor chips facing away from the carrier, removing the carrier, separating the auxiliary carrier between the semiconductor chips to form auxiliary carrier-chip units, each of the auxiliary carrier-chip units has at least one semiconductor chip and an auxiliary carrier part adjoining the semiconductor chip, arranging each of the auxiliary carrier-chip units on a connecting carrier and removing the auxiliary carrier parts from each auxiliary carrier-chip unit.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Method for Producing an Optoelectronic Semiconductor Component and Optoelectronic Semiconductor Component
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