Method for Producing an Optoelectronic Semiconductor Component and Optoelectronic Semiconductor Component
In an embodiment a method includes arranging a plurality of semiconductor chips on a carrier, arranging an auxiliary carrier on sides of the semiconductor chips facing away from the carrier, removing the carrier, separating the auxiliary carrier between the semiconductor chips to form auxiliary carr...
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creator | Huppmann, Sophia Geringer, Viktor Lindberg, Gudrun Tangring, Ivar |
description | In an embodiment a method includes arranging a plurality of semiconductor chips on a carrier, arranging an auxiliary carrier on sides of the semiconductor chips facing away from the carrier, removing the carrier, separating the auxiliary carrier between the semiconductor chips to form auxiliary carrier-chip units, each of the auxiliary carrier-chip units has at least one semiconductor chip and an auxiliary carrier part adjoining the semiconductor chip, arranging each of the auxiliary carrier-chip units on a connecting carrier and removing the auxiliary carrier parts from each auxiliary carrier-chip unit. |
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ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221124&DB=EPODOC&CC=US&NR=2022376133A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25555,76308</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221124&DB=EPODOC&CC=US&NR=2022376133A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Huppmann, Sophia</creatorcontrib><creatorcontrib>Geringer, Viktor</creatorcontrib><creatorcontrib>Lindberg, Gudrun</creatorcontrib><creatorcontrib>Tangring, Ivar</creatorcontrib><title>Method for Producing an Optoelectronic Semiconductor Component and Optoelectronic Semiconductor Component</title><description>In an embodiment a method includes arranging a plurality of semiconductor chips on a carrier, arranging an auxiliary carrier on sides of the semiconductor chips facing away from the carrier, removing the carrier, separating the auxiliary carrier between the semiconductor chips to form auxiliary carrier-chip units, each of the auxiliary carrier-chip units has at least one semiconductor chip and an auxiliary carrier part adjoining the semiconductor chip, arranging each of the auxiliary carrier-chip units on a connecting carrier and removing the auxiliary carrier parts from each auxiliary carrier-chip unit.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZMj0TS3JyE9RSMsvUggoyk8pTc7MS1dIzFPwLyjJT81JTS4pys_LTFYITs3NTM7PA8qXAFU65-cW5Oel5pUAVaYQqZSHgTUtMac4lRdKczMou7mGOHvophbkx6cWFyQmp-allsSHBhsZGBkZm5sZGhs7GhoTpwoAuOtCiw</recordid><startdate>20221124</startdate><enddate>20221124</enddate><creator>Huppmann, Sophia</creator><creator>Geringer, Viktor</creator><creator>Lindberg, Gudrun</creator><creator>Tangring, Ivar</creator><scope>EVB</scope></search><sort><creationdate>20221124</creationdate><title>Method for Producing an Optoelectronic Semiconductor Component and Optoelectronic Semiconductor Component</title><author>Huppmann, Sophia ; Geringer, Viktor ; Lindberg, Gudrun ; Tangring, Ivar</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2022376133A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Huppmann, Sophia</creatorcontrib><creatorcontrib>Geringer, Viktor</creatorcontrib><creatorcontrib>Lindberg, Gudrun</creatorcontrib><creatorcontrib>Tangring, Ivar</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Huppmann, Sophia</au><au>Geringer, Viktor</au><au>Lindberg, Gudrun</au><au>Tangring, Ivar</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for Producing an Optoelectronic Semiconductor Component and Optoelectronic Semiconductor Component</title><date>2022-11-24</date><risdate>2022</risdate><abstract>In an embodiment a method includes arranging a plurality of semiconductor chips on a carrier, arranging an auxiliary carrier on sides of the semiconductor chips facing away from the carrier, removing the carrier, separating the auxiliary carrier between the semiconductor chips to form auxiliary carrier-chip units, each of the auxiliary carrier-chip units has at least one semiconductor chip and an auxiliary carrier part adjoining the semiconductor chip, arranging each of the auxiliary carrier-chip units on a connecting carrier and removing the auxiliary carrier parts from each auxiliary carrier-chip unit.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Method for Producing an Optoelectronic Semiconductor Component and Optoelectronic Semiconductor Component |
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