INTEGRATED CIRCUITS WITH EMBEDDED LAYERS

The disclosure relates to integrated circuits and methods of manufacture. A method involves forming a first set of one or more circuit layers on a semiconductor substrate, placing at least one prefabricated layer portion onto the first set of circuit layers to form a component, and forming a second...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PATTEN, David, KHENKIN, Aleksey S
Format:	Patent
Sprache:	eng
Schlagworte:	ELECTRICITY
Online-Zugang:	Volltext bestellen
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