WAFER PROCESSING METHOD

A wafer processing method includes an affixing step of affixing a wafer to a sheet via a die attach layer having a diameter larger than a diameter of the wafer, to thereby form a protruding portion of the die attach layer on a periphery of the wafer, and a protruding portion removing step of removin...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HARADA, Shigenori, ZHAO, Jinyan
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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