HOUSING COMPRISING A COMPOSITE WALL INTEGRATING AT LEAST ONE COOLING CONDUIT

The disclosure relates to a housing comprising at least one composite wall comprising woven or braided carbon fibers covered with a thermoplastic or thermosetting resin, an electronic card carrying electronic components, and a heat transfer device having at least one portion facing an electronic com...

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Bibliographische Detailangaben
1. Verfasser: Sabah, Muriel
Format: Patent
Sprache:eng
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