THREE-DIMENSIONAL (3D) NAND COMPONENT WITH CONTROL CIRCUITRY ACROSS MULTIPLE WAFERS

Three-dimensional (3D) NAND components formed with control circuitry split across two wafers can provide for more area for control circuitry for an array, enabling improved 3D NAND system performance. In one example, a 3D NAND component includes a first die including a three-dimensional (3D) NAND ar...

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Hauptverfasser:	JUNGROTH, Owen, HASNAT, Khaled, MAJHI, Prashant, FASTOW, Richard, PARAT, Krishna K
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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