METHOD OF TESTING WAFER

METHOD OF TESTING WAFER

A method includes following steps. An image of a wafer is captured. A first contact region in the captured image at which the first conductive contact is rendered is identified. A second contact region in the captured image at which the second conductive contact is rendered is identified. The second...

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Hauptverfasser: TSENG, Chia-Yi, CHUANG, Kun-Tsang, LIN, Chih-Hsun, HSU, Yung-Lung, HO, Yen-Hsung
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator TSENG, Chia-Yi
CHUANG, Kun-Tsang
LIN, Chih-Hsun
HSU, Yung-Lung
HO, Yen-Hsung
description A method includes following steps. An image of a wafer is captured. A first contact region in the captured image at which the first conductive contact is rendered is identified. A second contact region in the captured image at which the second conductive contact is rendered is identified. The second conductive contact is determined as not shorted to the first conductive contact, in response to the identified second contact region in the captured image is darker than the identified first contact region in the captured image.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title METHOD OF TESTING WAFER
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