SECURING POWER SEMICONDUCTOR COMPONENTS TO CURVED SURFACES

The disclosure relates to an arrangement with a power module including power semiconductor components. The arrangement further includes a component having a curved surface. The power module is arranged on the curved surface of the component and is non-positively detachably connected to the component...

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Hauptverfasser:	Stegmeier, Stefan, Lasch, Markus, Müller, Claus, Raab, Oliver, Waltrich, Uwe
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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creator	Stegmeier, Stefan Lasch, Markus Müller, Claus Raab, Oliver Waltrich, Uwe
description	The disclosure relates to an arrangement with a power module including power semiconductor components. The arrangement further includes a component having a curved surface. The power module is arranged on the curved surface of the component and is non-positively detachably connected to the component. The disclosure also relates to a power converter with the arrangement and to a vehicle with a power converter.
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fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2022359342A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2022359342A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2022359342A13</originalsourceid><addsrcrecordid>eNrjZLAKdnUODfL0c1cI8A93DVIIdvX1dPb3cwl1DvEPUnD29w3w93P1CwlWCPFXACoMc3VRCA4NcnN0dg3mYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkZGxqaWxiZGjobGxKkCAJV3Km8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SECURING POWER SEMICONDUCTOR COMPONENTS TO CURVED SURFACES</title><source>esp@cenet</source><creator>Stegmeier, Stefan ; Lasch, Markus ; Müller, Claus ; Raab, Oliver ; Waltrich, Uwe</creator><creatorcontrib>Stegmeier, Stefan ; Lasch, Markus ; Müller, Claus ; Raab, Oliver ; Waltrich, Uwe</creatorcontrib><description>The disclosure relates to an arrangement with a power module including power semiconductor components. The arrangement further includes a component having a curved surface. The power module is arranged on the curved surface of the component and is non-positively detachably connected to the component. The disclosure also relates to a power converter with the arrangement and to a vehicle with a power converter.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221110&DB=EPODOC&CC=US&NR=2022359342A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221110&DB=EPODOC&CC=US&NR=2022359342A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Stegmeier, Stefan</creatorcontrib><creatorcontrib>Lasch, Markus</creatorcontrib><creatorcontrib>Müller, Claus</creatorcontrib><creatorcontrib>Raab, Oliver</creatorcontrib><creatorcontrib>Waltrich, Uwe</creatorcontrib><title>SECURING POWER SEMICONDUCTOR COMPONENTS TO CURVED SURFACES</title><description>The disclosure relates to an arrangement with a power module including power semiconductor components. The arrangement further includes a component having a curved surface. The power module is arranged on the curved surface of the component and is non-positively detachably connected to the component. The disclosure also relates to a power converter with the arrangement and to a vehicle with a power converter.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAKdnUODfL0c1cI8A93DVIIdvX1dPb3cwl1DvEPUnD29w3w93P1CwlWCPFXACoMc3VRCA4NcnN0dg3mYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkZGxqaWxiZGjobGxKkCAJV3Km8</recordid><startdate>20221110</startdate><enddate>20221110</enddate><creator>Stegmeier, Stefan</creator><creator>Lasch, Markus</creator><creator>Müller, Claus</creator><creator>Raab, Oliver</creator><creator>Waltrich, Uwe</creator><scope>EVB</scope></search><sort><creationdate>20221110</creationdate><title>SECURING POWER SEMICONDUCTOR COMPONENTS TO CURVED SURFACES</title><author>Stegmeier, Stefan ; Lasch, Markus ; Müller, Claus ; Raab, Oliver ; Waltrich, Uwe</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2022359342A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Stegmeier, Stefan</creatorcontrib><creatorcontrib>Lasch, Markus</creatorcontrib><creatorcontrib>Müller, Claus</creatorcontrib><creatorcontrib>Raab, Oliver</creatorcontrib><creatorcontrib>Waltrich, Uwe</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Stegmeier, Stefan</au><au>Lasch, Markus</au><au>Müller, Claus</au><au>Raab, Oliver</au><au>Waltrich, Uwe</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SECURING POWER SEMICONDUCTOR COMPONENTS TO CURVED SURFACES</title><date>2022-11-10</date><risdate>2022</risdate><abstract>The disclosure relates to an arrangement with a power module including power semiconductor components. The arrangement further includes a component having a curved surface. The power module is arranged on the curved surface of the component and is non-positively detachably connected to the component. The disclosure also relates to a power converter with the arrangement and to a vehicle with a power converter.</abstract><oa>free_for_read</oa></addata></record>
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language	eng
recordid	cdi_epo_espacenet_US2022359342A1
source	esp@cenet
subjects	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
title	SECURING POWER SEMICONDUCTOR COMPONENTS TO CURVED SURFACES
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-04T01%3A46%3A59IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Stegmeier,%20Stefan&rft.date=2022-11-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2022359342A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true