Barrier-Less Structures

Interconnect structures and method of forming the same are disclosed herein. An exemplary interconnect structure includes a first contact feature in a first dielectric layer, a second dielectric layer over the first dielectric layer, a second contact feature over the first contact feature, a barrier...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Shue, Shau-Lin, Chen, Hsin-Ping, Wu, Chia-Tien, Cao, Min, Yang, Shin-Yi, Wu, Yung-Hsu, Lee, Ming-Han
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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