SENSOR PACKAGE AND METHOD FOR ATTACHING SENSOR PACKAGE
The present invention relates to a sensor package to be attached to an object, and the sensor package includes: a first substrate; an FBG sensor; a resin portion and a first pressure-sensitive adhesive layer positioned on the first substrate; and an adhesive layer positioned on a surface of the resi...
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| creator | FUKUMOTO, Shintaro KIRA, Yoshiko IMAGAWA, Shun NISHIDO, Takayuki TANAKA, Akiko ISHIGURO, Shigeki |
| description | The present invention relates to a sensor package to be attached to an object, and the sensor package includes: a first substrate; an FBG sensor; a resin portion and a first pressure-sensitive adhesive layer positioned on the first substrate; and an adhesive layer positioned on a surface of the resin portion on a side opposite to the first substrate, in which the FBG sensor is held by the resin portion. |
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an FBG sensor; a resin portion and a first pressure-sensitive adhesive layer positioned on the first substrate; and an adhesive layer positioned on a surface of the resin portion on a side opposite to the first substrate, in which the FBG sensor is held by the resin portion.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS CHEMISTRY DYES MEASURING MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PHYSICS POLISHES TARIFF METERING APPARATUS TESTING USE OF MATERIALS AS ADHESIVES |
| title | SENSOR PACKAGE AND METHOD FOR ATTACHING SENSOR PACKAGE |
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