FLOW METROLOGY CALIBRATION FOR IMPROVED PROCESSING CHAMBER MATCHING IN SUBSTRATE PROCESSING SYSTEMS

FLOW METROLOGY CALIBRATION FOR IMPROVED PROCESSING CHAMBER MATCHING IN SUBSTRATE PROCESSING SYSTEMS

A method for calibrating a gas flow metrology system for a substrate processing system includes a) measuring temperature using a first temperature sensor and a reference temperature sensor over a predetermined temperature range and determining a first transfer function; b) measuring pressure using a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SPYROPOULOS, Evangelos T, AGARWAL, Plyush
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRICITY
MEASURING
MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUIDLEVEL
METERING BY VOLUME
PHYSICS
TESTING
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator SPYROPOULOS, Evangelos T
AGARWAL, Plyush
description A method for calibrating a gas flow metrology system for a substrate processing system includes a) measuring temperature using a first temperature sensor and a reference temperature sensor over a predetermined temperature range and determining a first transfer function; b) measuring pressure using a first pressure sensor and a reference pressure sensor over a predetermined pressure range using a first calibration gas and determining a second transfer function; c) performing a first plurality of flow rate measurements in a predetermined flow rate range with a first metrology system and a reference metrology system, wherein the first metrology system and the reference metrology system use a first orifice size and the first calibration gas; and d) scaling temperature and pressure using the first transfer function and the second transfer function, respectively, and determining a corresponding transfer function for the first calibration gas based on the first plurality of flow rate measurements.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2022333972A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2022333972A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2022333972A13</originalsourceid><addsrcrecordid>eNqNi7EKwjAUALM4iPoPD5wFTQZxTOJLG2gSyUsrnUopcRIt1P_HCg6OTgfH3ZINpgpXcJhiqELRgpaVVVEmGzyYEMG6SwwNnmGGRiLrC9CldAojOJl0-RHWA9WK0vzhb0gtJXS0Zotbf5_y5ssV2xqc110en12exn7Ij_zqauJ7zoUQpyOXB_Ff9QY_UDXS</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>FLOW METROLOGY CALIBRATION FOR IMPROVED PROCESSING CHAMBER MATCHING IN SUBSTRATE PROCESSING SYSTEMS</title><source>esp@cenet</source><creator>SPYROPOULOS, Evangelos T ; AGARWAL, Plyush</creator><creatorcontrib>SPYROPOULOS, Evangelos T ; AGARWAL, Plyush</creatorcontrib><description>A method for calibrating a gas flow metrology system for a substrate processing system includes a) measuring temperature using a first temperature sensor and a reference temperature sensor over a predetermined temperature range and determining a first transfer function; b) measuring pressure using a first pressure sensor and a reference pressure sensor over a predetermined pressure range using a first calibration gas and determining a second transfer function; c) performing a first plurality of flow rate measurements in a predetermined flow rate range with a first metrology system and a reference metrology system, wherein the first metrology system and the reference metrology system use a first orifice size and the first calibration gas; and d) scaling temperature and pressure using the first transfer function and the second transfer function, respectively, and determining a corresponding transfer function for the first calibration gas based on the first plurality of flow rate measurements.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRICITY ; MEASURING ; MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUIDLEVEL ; METERING BY VOLUME ; PHYSICS ; TESTING</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20221020&amp;DB=EPODOC&amp;CC=US&amp;NR=2022333972A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20221020&amp;DB=EPODOC&amp;CC=US&amp;NR=2022333972A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SPYROPOULOS, Evangelos T</creatorcontrib><creatorcontrib>AGARWAL, Plyush</creatorcontrib><title>FLOW METROLOGY CALIBRATION FOR IMPROVED PROCESSING CHAMBER MATCHING IN SUBSTRATE PROCESSING SYSTEMS</title><description>A method for calibrating a gas flow metrology system for a substrate processing system includes a) measuring temperature using a first temperature sensor and a reference temperature sensor over a predetermined temperature range and determining a first transfer function; b) measuring pressure using a first pressure sensor and a reference pressure sensor over a predetermined pressure range using a first calibration gas and determining a second transfer function; c) performing a first plurality of flow rate measurements in a predetermined flow rate range with a first metrology system and a reference metrology system, wherein the first metrology system and the reference metrology system use a first orifice size and the first calibration gas; and d) scaling temperature and pressure using the first transfer function and the second transfer function, respectively, and determining a corresponding transfer function for the first calibration gas based on the first plurality of flow rate measurements.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRICITY</subject><subject>MEASURING</subject><subject>MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUIDLEVEL</subject><subject>METERING BY VOLUME</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNi7EKwjAUALM4iPoPD5wFTQZxTOJLG2gSyUsrnUopcRIt1P_HCg6OTgfH3ZINpgpXcJhiqELRgpaVVVEmGzyYEMG6SwwNnmGGRiLrC9CldAojOJl0-RHWA9WK0vzhb0gtJXS0Zotbf5_y5ssV2xqc110en12exn7Ij_zqauJ7zoUQpyOXB_Ff9QY_UDXS</recordid><startdate>20221020</startdate><enddate>20221020</enddate><creator>SPYROPOULOS, Evangelos T</creator><creator>AGARWAL, Plyush</creator><scope>EVB</scope></search><sort><creationdate>20221020</creationdate><title>FLOW METROLOGY CALIBRATION FOR IMPROVED PROCESSING CHAMBER MATCHING IN SUBSTRATE PROCESSING SYSTEMS</title><author>SPYROPOULOS, Evangelos T ; AGARWAL, Plyush</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2022333972A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRICITY</topic><topic>MEASURING</topic><topic>MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUIDLEVEL</topic><topic>METERING BY VOLUME</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>SPYROPOULOS, Evangelos T</creatorcontrib><creatorcontrib>AGARWAL, Plyush</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SPYROPOULOS, Evangelos T</au><au>AGARWAL, Plyush</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FLOW METROLOGY CALIBRATION FOR IMPROVED PROCESSING CHAMBER MATCHING IN SUBSTRATE PROCESSING SYSTEMS</title><date>2022-10-20</date><risdate>2022</risdate><abstract>A method for calibrating a gas flow metrology system for a substrate processing system includes a) measuring temperature using a first temperature sensor and a reference temperature sensor over a predetermined temperature range and determining a first transfer function; b) measuring pressure using a first pressure sensor and a reference pressure sensor over a predetermined pressure range using a first calibration gas and determining a second transfer function; c) performing a first plurality of flow rate measurements in a predetermined flow rate range with a first metrology system and a reference metrology system, wherein the first metrology system and the reference metrology system use a first orifice size and the first calibration gas; and d) scaling temperature and pressure using the first transfer function and the second transfer function, respectively, and determining a corresponding transfer function for the first calibration gas based on the first plurality of flow rate measurements.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2022333972A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRICITY
MEASURING
MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUIDLEVEL
METERING BY VOLUME
PHYSICS
TESTING
title FLOW METROLOGY CALIBRATION FOR IMPROVED PROCESSING CHAMBER MATCHING IN SUBSTRATE PROCESSING SYSTEMS
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-26T03%3A29%3A09IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SPYROPOULOS,%20Evangelos%20T&rft.date=2022-10-20&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2022333972A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true