SUBSTRATE HANDLING DEVICE AND PROCESSING CHAMBER

A substrate handling device includes a substrate reception area defined by an edge. The substrate reception area includes a planar surface, wherein the edge extends upward from the planar surface. The substrate reception area further includes a plurality of contact structures extending upwards from...

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Hauptverfasser: CHOU, You-Hua, CHUANG, Kuo-Sheng
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creator CHOU, You-Hua
CHUANG, Kuo-Sheng
description A substrate handling device includes a substrate reception area defined by an edge. The substrate reception area includes a planar surface, wherein the edge extends upward from the planar surface. The substrate reception area further includes a plurality of contact structures extending upwards from the planar surface, wherein a first contact structure of the plurality of contact structures directly contacts a side surface of the edge, a second contact structure of the plurality of contact structures separated from the edge, a shape of the first contact structure is different from a shape of the second contact structure. The substrate reception area and the planar surface include a first material. Each contact structure of the plurality of contact structures includes a second material different from the first material, and the second material has a hardness aligned to a hardness of a substrate material.
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subjects BASIC ELECTRIC ELEMENTS
CHAMBERS PROVIDED WITH MANIPULATION DEVICES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HAND TOOLS
MANIPULATORS
PERFORMING OPERATIONS
PORTABLE POWER-DRIVEN TOOLS
SEMICONDUCTOR DEVICES
TRANSPORTING
title SUBSTRATE HANDLING DEVICE AND PROCESSING CHAMBER
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