MASSIVE PARALLEL ASSEMBLY METHOD

Embodiments provide a method for manufacturing a device. The method comprises providing a first carrier having attached thereto a plurality of chips by means of an adhesive layer of the first carrier, a first surface of the plurality of chips being attached to the first carrier. Further, the method...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MANIER, Charles-Alix, OPPERMANN, Hans-Hermann, ZOSCHKE, Kai
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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