MASSIVE PARALLEL ASSEMBLY METHOD

MASSIVE PARALLEL ASSEMBLY METHOD

Embodiments provide a method for manufacturing a device. The method comprises providing a first carrier having attached thereto a plurality of chips by means of an adhesive layer of the first carrier, a first surface of the plurality of chips being attached to the first carrier. Further, the method...

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Hauptverfasser: MANIER, Charles-Alix, OPPERMANN, Hans-Hermann, ZOSCHKE, Kai
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator MANIER, Charles-Alix
OPPERMANN, Hans-Hermann
ZOSCHKE, Kai
description Embodiments provide a method for manufacturing a device. The method comprises providing a first carrier having attached thereto a plurality of chips by means of an adhesive layer of the first carrier, a first surface of the plurality of chips being attached to the first carrier. Further, the method comprises selectively attaching a second surface of a subset of the plurality of chips to a conveyor carrier by means of a structured adhesive layer of the conveyor layer. Further, the method comprises selectively releasing the subset of the plurality of chips from the first carrier by means of debonding corresponding sections of the adhesive layer of the first carrier. Further, the method comprises attaching the first surface of the subset of the plurality of chips to a substrate of the device.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title MASSIVE PARALLEL ASSEMBLY METHOD
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