LED CHIP MODULE AND METHOD FOR MANUFACTURING LED CHIP MODULE

LED CHIP MODULE AND METHOD FOR MANUFACTURING LED CHIP MODULE

A flip LED chip module and a method for manufacturing LED chip module are provided. In the manufactured flip LED chip module, the second glue layer for reducing light energy is formed on the front surface of each of the flip LED chips. Therefore, the difference between the light intensity of the lig...

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Hauptverfasser: XING, Meizheng, LIU, Yong, SUN, Pingru, SU, Hongbo, CHEN, Yanming
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator XING, Meizheng
LIU, Yong
SUN, Pingru
SU, Hongbo
CHEN, Yanming
description A flip LED chip module and a method for manufacturing LED chip module are provided. In the manufactured flip LED chip module, the second glue layer for reducing light energy is formed on the front surface of each of the flip LED chips. Therefore, the difference between the light intensity of the light along the normal direction of the flip LED chip and the light intensity of the light at the four sides of the flip LED chip can be reduced, thus improving the uniformity of the color of the light. Hence, the color of the light of the LED device manufactured by the LED chip module can be more uniform, thus improving the quality of the LED device and the user satisfaction.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title LED CHIP MODULE AND METHOD FOR MANUFACTURING LED CHIP MODULE
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