COMPACT POWER ELECTRONICS MODULE WITH INCREASED COOLING SURFACE

The invention relates to a power electronics module including a first circuit carrier (5,10, 11), as well as an electronic assembly (20, 30) arranged in an electrically contacting manner on the upper flat side of the first circuit carrier (5, 10, 11), and a first cooling element (40) in thermal cont...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Eisele, Ronald, Behrendt, Stefan
Format: Patent
Sprache:eng
Schlagworte:
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