SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

A semiconductor manufacturing method includes forming a concave portion in a layer provided above a substrate from a top surface of the layer downwards, the layer including an insulation layer at least partially. The method includes forming a silicon film on an inner surface of the concave portion....

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	IDE, Kenichi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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