LEAD-FREE LOW-MELTING GLASS COMPOSITION AND LOW-MELTING GLASS COMPOSITE MATERIAL AND LOW-MELTING GLASS PASTE CONTAINING LEAD-FREE LOW-MELTING GLASS COMPOSITION, AND SEALING STRUCTURE, ELECTRICAL AND ELECTRONIC PART AND COATED PART USING SAME

A lead-free low-melting glass composition containing vanadium oxide, tellurium oxide, silver oxide and lithium oxide, said composition satisfying the following two relational expressions (1) and (2) in terms of oxides.[Ag2O]≥[TeO2]≥[V2O5]≥[Li2O] (1)2[V2O5]≥[Ag2O]+[Li2O]≥40 (2)(In the formula, [X]...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HASHIBA, Yuji, AOYAGI, Takuya, NAITO, Takashi, MIYAKE, Tatsuya, TACHIZONO, Shinichi, ONODERA, Taigo
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS METALLURGY MINERAL OR SLAG WOOL SEMICONDUCTOR DEVICES SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	HASHIBA, Yuji AOYAGI, Takuya NAITO, Takashi MIYAKE, Tatsuya TACHIZONO, Shinichi ONODERA, Taigo
description	A lead-free low-melting glass composition containing vanadium oxide, tellurium oxide, silver oxide and lithium oxide, said composition satisfying the following two relational expressions (1) and (2) in terms of oxides.[Ag2O]≥[TeO2]≥[V2O5]≥[Li2O] (1)2[V2O5]≥[Ag2O]+[Li2O]≥40 (2)(In the formula, [X] represents a content of component X, and the unit thereof is "mol %"; the same applies hereinafter.) Thus, it is possible to provide a lead-free low-melting glass composition which enables sealing and adhesion at around the melting point (232° C.) of tin and which has high adhesiveness and stickiness.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2022289621A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2022289621A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2022289621A13</originalsourceid><addsrcrecordid>eNqNjr0KwkAQhNNYiPoOB7YJmBNEy-WyiQf3I3cbLEOQsxINxBf3Dcxfq6RaZvbbnVlGH4WQJblDZMpeE42KpClYocB7Jqy-WC9JWsPAZH8IZBoInQT1A7yA7yBhDYE0vT0zNx7-eQTVrz25UlDpMGaoUJCTYkocpTVSdFGOBk_YrlM26tIP96BxHS3u9aMNm2muom2OJM5JaF5VaJv6Fp7hXZWe7zjnx9OBp5Du51FfGxBbxA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>LEAD-FREE LOW-MELTING GLASS COMPOSITION AND LOW-MELTING GLASS COMPOSITE MATERIAL AND LOW-MELTING GLASS PASTE CONTAINING LEAD-FREE LOW-MELTING GLASS COMPOSITION, AND SEALING STRUCTURE, ELECTRICAL AND ELECTRONIC PART AND COATED PART USING SAME</title><source>esp@cenet</source><creator>HASHIBA, Yuji ; AOYAGI, Takuya ; NAITO, Takashi ; MIYAKE, Tatsuya ; TACHIZONO, Shinichi ; ONODERA, Taigo</creator><creatorcontrib>HASHIBA, Yuji ; AOYAGI, Takuya ; NAITO, Takashi ; MIYAKE, Tatsuya ; TACHIZONO, Shinichi ; ONODERA, Taigo</creatorcontrib><description>A lead-free low-melting glass composition containing vanadium oxide, tellurium oxide, silver oxide and lithium oxide, said composition satisfying the following two relational expressions (1) and (2) in terms of oxides.[Ag2O]≥[TeO2]≥[V2O5]≥[Li2O] (1)2[V2O5]≥[Ag2O]+[Li2O]≥40 (2)(In the formula, [X] represents a content of component X, and the unit thereof is "mol %"; the same applies hereinafter.) Thus, it is possible to provide a lead-free low-melting glass composition which enables sealing and adhesion at around the melting point (232° C.) of tin and which has high adhesiveness and stickiness.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS ; CHEMISTRY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GLASS ; JOINING GLASS TO GLASS OR OTHER MATERIALS ; METALLURGY ; MINERAL OR SLAG WOOL ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS ; SURFACE TREATMENT OF GLASS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220915&DB=EPODOC&CC=US&NR=2022289621A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220915&DB=EPODOC&CC=US&NR=2022289621A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HASHIBA, Yuji</creatorcontrib><creatorcontrib>AOYAGI, Takuya</creatorcontrib><creatorcontrib>NAITO, Takashi</creatorcontrib><creatorcontrib>MIYAKE, Tatsuya</creatorcontrib><creatorcontrib>TACHIZONO, Shinichi</creatorcontrib><creatorcontrib>ONODERA, Taigo</creatorcontrib><title>LEAD-FREE LOW-MELTING GLASS COMPOSITION AND LOW-MELTING GLASS COMPOSITE MATERIAL AND LOW-MELTING GLASS PASTE CONTAINING LEAD-FREE LOW-MELTING GLASS COMPOSITION, AND SEALING STRUCTURE, ELECTRICAL AND ELECTRONIC PART AND COATED PART USING SAME</title><description>A lead-free low-melting glass composition containing vanadium oxide, tellurium oxide, silver oxide and lithium oxide, said composition satisfying the following two relational expressions (1) and (2) in terms of oxides.[Ag2O]≥[TeO2]≥[V2O5]≥[Li2O] (1)2[V2O5]≥[Ag2O]+[Li2O]≥40 (2)(In the formula, [X] represents a content of component X, and the unit thereof is "mol %"; the same applies hereinafter.) Thus, it is possible to provide a lead-free low-melting glass composition which enables sealing and adhesion at around the melting point (232° C.) of tin and which has high adhesiveness and stickiness.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS</subject><subject>CHEMISTRY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GLASS</subject><subject>JOINING GLASS TO GLASS OR OTHER MATERIALS</subject><subject>METALLURGY</subject><subject>MINERAL OR SLAG WOOL</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS</subject><subject>SURFACE TREATMENT OF GLASS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjr0KwkAQhNNYiPoOB7YJmBNEy-WyiQf3I3cbLEOQsxINxBf3Dcxfq6RaZvbbnVlGH4WQJblDZMpeE42KpClYocB7Jqy-WC9JWsPAZH8IZBoInQT1A7yA7yBhDYE0vT0zNx7-eQTVrz25UlDpMGaoUJCTYkocpTVSdFGOBk_YrlM26tIP96BxHS3u9aMNm2muom2OJM5JaF5VaJv6Fp7hXZWe7zjnx9OBp5Du51FfGxBbxA</recordid><startdate>20220915</startdate><enddate>20220915</enddate><creator>HASHIBA, Yuji</creator><creator>AOYAGI, Takuya</creator><creator>NAITO, Takashi</creator><creator>MIYAKE, Tatsuya</creator><creator>TACHIZONO, Shinichi</creator><creator>ONODERA, Taigo</creator><scope>EVB</scope></search><sort><creationdate>20220915</creationdate><title>LEAD-FREE LOW-MELTING GLASS COMPOSITION AND LOW-MELTING GLASS COMPOSITE MATERIAL AND LOW-MELTING GLASS PASTE CONTAINING LEAD-FREE LOW-MELTING GLASS COMPOSITION, AND SEALING STRUCTURE, ELECTRICAL AND ELECTRONIC PART AND COATED PART USING SAME</title><author>HASHIBA, Yuji ; AOYAGI, Takuya ; NAITO, Takashi ; MIYAKE, Tatsuya ; TACHIZONO, Shinichi ; ONODERA, Taigo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2022289621A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS</topic><topic>CHEMISTRY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GLASS</topic><topic>JOINING GLASS TO GLASS OR OTHER MATERIALS</topic><topic>METALLURGY</topic><topic>MINERAL OR SLAG WOOL</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS</topic><topic>SURFACE TREATMENT OF GLASS</topic><toplevel>online_resources</toplevel><creatorcontrib>HASHIBA, Yuji</creatorcontrib><creatorcontrib>AOYAGI, Takuya</creatorcontrib><creatorcontrib>NAITO, Takashi</creatorcontrib><creatorcontrib>MIYAKE, Tatsuya</creatorcontrib><creatorcontrib>TACHIZONO, Shinichi</creatorcontrib><creatorcontrib>ONODERA, Taigo</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HASHIBA, Yuji</au><au>AOYAGI, Takuya</au><au>NAITO, Takashi</au><au>MIYAKE, Tatsuya</au><au>TACHIZONO, Shinichi</au><au>ONODERA, Taigo</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LEAD-FREE LOW-MELTING GLASS COMPOSITION AND LOW-MELTING GLASS COMPOSITE MATERIAL AND LOW-MELTING GLASS PASTE CONTAINING LEAD-FREE LOW-MELTING GLASS COMPOSITION, AND SEALING STRUCTURE, ELECTRICAL AND ELECTRONIC PART AND COATED PART USING SAME</title><date>2022-09-15</date><risdate>2022</risdate><abstract>A lead-free low-melting glass composition containing vanadium oxide, tellurium oxide, silver oxide and lithium oxide, said composition satisfying the following two relational expressions (1) and (2) in terms of oxides.[Ag2O]≥[TeO2]≥[V2O5]≥[Li2O] (1)2[V2O5]≥[Ag2O]+[Li2O]≥40 (2)(In the formula, [X] represents a content of component X, and the unit thereof is "mol %"; the same applies hereinafter.) Thus, it is possible to provide a lead-free low-melting glass composition which enables sealing and adhesion at around the melting point (232° C.) of tin and which has high adhesiveness and stickiness.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng
recordid	cdi_epo_espacenet_US2022289621A1
source	esp@cenet
subjects	BASIC ELECTRIC ELEMENTS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS METALLURGY MINERAL OR SLAG WOOL SEMICONDUCTOR DEVICES SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS
title	LEAD-FREE LOW-MELTING GLASS COMPOSITION AND LOW-MELTING GLASS COMPOSITE MATERIAL AND LOW-MELTING GLASS PASTE CONTAINING LEAD-FREE LOW-MELTING GLASS COMPOSITION, AND SEALING STRUCTURE, ELECTRICAL AND ELECTRONIC PART AND COATED PART USING SAME
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-14T22%3A42%3A04IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HASHIBA,%20Yuji&rft.date=2022-09-15&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2022289621A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true