LEAD-FREE LOW-MELTING GLASS COMPOSITION AND LOW-MELTING GLASS COMPOSITE MATERIAL AND LOW-MELTING GLASS PASTE CONTAINING LEAD-FREE LOW-MELTING GLASS COMPOSITION, AND SEALING STRUCTURE, ELECTRICAL AND ELECTRONIC PART AND COATED PART USING SAME

A lead-free low-melting glass composition containing vanadium oxide, tellurium oxide, silver oxide and lithium oxide, said composition satisfying the following two relational expressions (1) and (2) in terms of oxides.[Ag2O]≥[TeO2]≥[V2O5]≥[Li2O]  (1)2[V2O5]≥[Ag2O]+[Li2O]≥40  (2)(In the formula, [X]...

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Hauptverfasser: HASHIBA, Yuji, AOYAGI, Takuya, NAITO, Takashi, MIYAKE, Tatsuya, TACHIZONO, Shinichi, ONODERA, Taigo
Format: Patent
Sprache:eng
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Zusammenfassung:A lead-free low-melting glass composition containing vanadium oxide, tellurium oxide, silver oxide and lithium oxide, said composition satisfying the following two relational expressions (1) and (2) in terms of oxides.[Ag2O]≥[TeO2]≥[V2O5]≥[Li2O]  (1)2[V2O5]≥[Ag2O]+[Li2O]≥40  (2)(In the formula, [X] represents a content of component X, and the unit thereof is "mol %"; the same applies hereinafter.) Thus, it is possible to provide a lead-free low-melting glass composition which enables sealing and adhesion at around the melting point (232° C.) of tin and which has high adhesiveness and stickiness.