SEMICONDUCTOR DEVICE PACKAGE HAVING GALVANIC ISOLATION AND METHOD THEREFOR

A semiconductor device package having galvanic isolation is provided. The semiconductor device includes a package substrate having a first inductive coil formed from a first conductive layer and a second inductive coil formed from a second conductive layer. The first conductive layer and the second...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Carpenter, Burton Jesse, Brauchler, Fred T
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!