HETEROGENEOUS PACKAGING INTEGRATION OF PHOTONIC AND ELECTRONIC ELEMENTS

Heterogeneous packaging integration of photonic and electronic elements is described herein. In one embodiment, a disclosed package includes: a package substrate; a first layer comprising an electronic die on the package substrate; and a second layer comprising a photonic die. The second layer is bo...

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Hauptverfasser:	Song, Wei-wei, RUSU, Stefan, Islam, Mohammed Rabiul
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS SEMICONDUCTOR DEVICES
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creator	Song, Wei-wei RUSU, Stefan Islam, Mohammed Rabiul
description	Heterogeneous packaging integration of photonic and electronic elements is described herein. In one embodiment, a disclosed package includes: a package substrate; a first layer comprising an electronic die on the package substrate; and a second layer comprising a photonic die. The second layer is bonded onto the first layer such that the photonic die is bonded onto the electronic die.
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fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2022283387A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2022283387A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2022283387A13</originalsourceid><addsrcrecordid>eNrjZHD3cA1xDfJ3d_Vz9Q8NVghwdPZ2dPf0c1fw9AtxdQ9yDPH091Pwd1MI8PAP8ffzdFZw9HNRcPVxdQ4JAnOBTF9Xv5BgHgbWtMSc4lReKM3NoOzmGuLsoZtakB-fWlyQmJyal1oSHxpsZGBkZGRhbGxh7mhoTJwqAKxOLcM</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>HETEROGENEOUS PACKAGING INTEGRATION OF PHOTONIC AND ELECTRONIC ELEMENTS</title><source>esp@cenet</source><creator>Song, Wei-wei ; RUSU, Stefan ; Islam, Mohammed Rabiul</creator><creatorcontrib>Song, Wei-wei ; RUSU, Stefan ; Islam, Mohammed Rabiul</creatorcontrib><description>Heterogeneous packaging integration of photonic and electronic elements is described herein. In one embodiment, a disclosed package includes: a package substrate; a first layer comprising an electronic die on the package substrate; and a second layer comprising a photonic die. The second layer is bonded onto the first layer such that the photonic die is bonded onto the electronic die.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220908&DB=EPODOC&CC=US&NR=2022283387A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220908&DB=EPODOC&CC=US&NR=2022283387A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Song, Wei-wei</creatorcontrib><creatorcontrib>RUSU, Stefan</creatorcontrib><creatorcontrib>Islam, Mohammed Rabiul</creatorcontrib><title>HETEROGENEOUS PACKAGING INTEGRATION OF PHOTONIC AND ELECTRONIC ELEMENTS</title><description>Heterogeneous packaging integration of photonic and electronic elements is described herein. In one embodiment, a disclosed package includes: a package substrate; a first layer comprising an electronic die on the package substrate; and a second layer comprising a photonic die. The second layer is bonded onto the first layer such that the photonic die is bonded onto the electronic die.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD3cA1xDfJ3d_Vz9Q8NVghwdPZ2dPf0c1fw9AtxdQ9yDPH091Pwd1MI8PAP8ffzdFZw9HNRcPVxdQ4JAnOBTF9Xv5BgHgbWtMSc4lReKM3NoOzmGuLsoZtakB-fWlyQmJyal1oSHxpsZGBkZGRhbGxh7mhoTJwqAKxOLcM</recordid><startdate>20220908</startdate><enddate>20220908</enddate><creator>Song, Wei-wei</creator><creator>RUSU, Stefan</creator><creator>Islam, Mohammed Rabiul</creator><scope>EVB</scope></search><sort><creationdate>20220908</creationdate><title>HETEROGENEOUS PACKAGING INTEGRATION OF PHOTONIC AND ELECTRONIC ELEMENTS</title><author>Song, Wei-wei ; RUSU, Stefan ; Islam, Mohammed Rabiul</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2022283387A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Song, Wei-wei</creatorcontrib><creatorcontrib>RUSU, Stefan</creatorcontrib><creatorcontrib>Islam, Mohammed Rabiul</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Song, Wei-wei</au><au>RUSU, Stefan</au><au>Islam, Mohammed Rabiul</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HETEROGENEOUS PACKAGING INTEGRATION OF PHOTONIC AND ELECTRONIC ELEMENTS</title><date>2022-09-08</date><risdate>2022</risdate><abstract>Heterogeneous packaging integration of photonic and electronic elements is described herein. In one embodiment, a disclosed package includes: a package substrate; a first layer comprising an electronic die on the package substrate; and a second layer comprising a photonic die. The second layer is bonded onto the first layer such that the photonic die is bonded onto the electronic die.</abstract><oa>free_for_read</oa></addata></record>
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subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS SEMICONDUCTOR DEVICES
title	HETEROGENEOUS PACKAGING INTEGRATION OF PHOTONIC AND ELECTRONIC ELEMENTS
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-04T12%3A41%3A49IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Song,%20Wei-wei&rft.date=2022-09-08&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2022283387A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true