CONTROL OF PROCESSING PARAMETERS FOR SUBSTRATE POLISHING WITH ANGULARLY DISTRIBUTED ZONES USING COST FUNCTION

Generating a recipe for controlling a polishing system includes receiving a target removal profile that includes a target thickness to remove for a plurality of locations on a substrate that are angularly distributed around the substrate, and storing a first function defining a polishing rate for a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Cherian, Benjamin, Garretson, Charles C, Brown, Brian J, Osterheld, Thomas H, Zhang, Huanbo, Lau, Eric, Zhu, Zhize
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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