OVERLAPPING DIE STACKS FOR NAND PACKAGE ARCHITECTURE

A semiconductor device assembly includes a substrate, a first stack of semiconductor dies disposed directly over a first location on the substrate, and a second stack of semiconductor dies disposed directly over a second location on the substrate and electrically coupled to a second subset of the pl...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Tai, Enyong, Wang, Li, Ng, Hong Wan, Takiar, Hem P
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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