SEMICONDUCTOR CHIP HAVING A CRACK STOP STRUCTURE

SEMICONDUCTOR CHIP HAVING A CRACK STOP STRUCTURE

A semiconductor chip having a crack stop structure is disclosed. The crack stop structure includes one or more recesses formed in the semiconductor chip. The one or more recesses extend adjacent to and along a periphery of the semiconductor chip. The one or more recesses are filled with a metal mate...

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Hauptverfasser: Bauer, Andreas, Heidenblut, Maria, Mackh, Gunther, Kaiser, Stefan, Ananiev, Sergey, Mutamba, Kabula, Reuther, Georg, Goroll, Michael, Pufall, Reinhard
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Bauer, Andreas
Heidenblut, Maria
Mackh, Gunther
Kaiser, Stefan
Ananiev, Sergey
Mutamba, Kabula
Reuther, Georg
Goroll, Michael
Pufall, Reinhard
description A semiconductor chip having a crack stop structure is disclosed. The crack stop structure includes one or more recesses formed in the semiconductor chip. The one or more recesses extend adjacent to and along a periphery of the semiconductor chip. The one or more recesses are filled with a metal material. The metal material has an intrinsic tensile stress at room temperature that induces compressive stress in at least a region of the periphery of the semiconductor chip.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR CHIP HAVING A CRACK STOP STRUCTURE
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