PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, METHOD FOR PRODUCING CURED PRODUCT, LAMINATE, AND ELECTRONIC COMPONENT

A photosensitive resin composition containing: a component (A) which is a high molecular weight compound having a photopolymerizable functional group and a carbon-nitrogen bond; a component (B) which is a low molecular weight compound having a photopolymerizable functional group; a component (C) whi...

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Hauptverfasser: ARAI, Tatsuhiko, NARITA, Mao, ONO, Keishi, KURODA, Naoto
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creator ARAI, Tatsuhiko
NARITA, Mao
ONO, Keishi
KURODA, Naoto
description A photosensitive resin composition containing: a component (A) which is a high molecular weight compound having a photopolymerizable functional group and a carbon-nitrogen bond; a component (B) which is a low molecular weight compound having a photopolymerizable functional group; a component (C) which is a photopolymerization initiator; and a component (D) which is a triazole-based compound.
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subjects ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAININGELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN,SULFUR, SELENIUM OR TELLURIUM
CHEMISTRY
COMPOSITIONS BASED THEREON
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
METALLURGY
ORGANIC CHEMISTRY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
title PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, METHOD FOR PRODUCING CURED PRODUCT, LAMINATE, AND ELECTRONIC COMPONENT
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