PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, METHOD FOR PRODUCING CURED PRODUCT, LAMINATE, AND ELECTRONIC COMPONENT
A photosensitive resin composition containing: a component (A) which is a high molecular weight compound having a photopolymerizable functional group and a carbon-nitrogen bond; a component (B) which is a low molecular weight compound having a photopolymerizable functional group; a component (C) whi...
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creator | ARAI, Tatsuhiko NARITA, Mao ONO, Keishi KURODA, Naoto |
description | A photosensitive resin composition containing: a component (A) which is a high molecular weight compound having a photopolymerizable functional group and a carbon-nitrogen bond; a component (B) which is a low molecular weight compound having a photopolymerizable functional group; a component (C) which is a photopolymerization initiator; and a component (D) which is a triazole-based compound. |
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a component (B) which is a low molecular weight compound having a photopolymerizable functional group; a component (C) which is a photopolymerization initiator; and a component (D) which is a triazole-based compound.</description><language>eng</language><subject>ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAININGELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN,SULFUR, SELENIUM OR TELLURIUM ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; METALLURGY ; ORGANIC CHEMISTRY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220825&DB=EPODOC&CC=US&NR=2022267484A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220825&DB=EPODOC&CC=US&NR=2022267484A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ARAI, Tatsuhiko</creatorcontrib><creatorcontrib>NARITA, Mao</creatorcontrib><creatorcontrib>ONO, Keishi</creatorcontrib><creatorcontrib>KURODA, Naoto</creatorcontrib><title>PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, METHOD FOR PRODUCING CURED PRODUCT, LAMINATE, AND ELECTRONIC COMPONENT</title><description>A photosensitive resin composition containing: a component (A) which is a high molecular weight compound having a photopolymerizable functional group and a carbon-nitrogen bond; 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NARITA, Mao ; ONO, Keishi ; KURODA, Naoto</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2022267484A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAININGELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN,SULFUR, SELENIUM OR TELLURIUM</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC CHEMISTRY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>ARAI, Tatsuhiko</creatorcontrib><creatorcontrib>NARITA, Mao</creatorcontrib><creatorcontrib>ONO, Keishi</creatorcontrib><creatorcontrib>KURODA, Naoto</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ARAI, Tatsuhiko</au><au>NARITA, Mao</au><au>ONO, Keishi</au><au>KURODA, Naoto</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, METHOD FOR PRODUCING CURED PRODUCT, LAMINATE, AND ELECTRONIC COMPONENT</title><date>2022-08-25</date><risdate>2022</risdate><abstract>A photosensitive resin composition containing: a component (A) which is a high molecular weight compound having a photopolymerizable functional group and a carbon-nitrogen bond; a component (B) which is a low molecular weight compound having a photopolymerizable functional group; a component (C) which is a photopolymerization initiator; and a component (D) which is a triazole-based compound.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAININGELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN,SULFUR, SELENIUM OR TELLURIUM CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC CHEMISTRY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
title | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, METHOD FOR PRODUCING CURED PRODUCT, LAMINATE, AND ELECTRONIC COMPONENT |
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