SEMICONDUCTOR PACKAGE INCLUDING THERMAL EXHAUST PATHWAY

A semiconductor package includes; a wiring structure including signal wiring and heat transfer wiring, an active chip on the wiring structure, a signal terminal disposed between the wiring structure and the active chip, a first heat transferring terminal disposed between the wiring structure and the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM, EUNGKYU, SUK, KYOUNGLIM
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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