MOLDED SEMICONDUCTOR MODULE HAVING A MOLD STEP FOR INCREASING CREEPAGE DISTANCE

A semiconductor module includes: a dual-gauge leadframe having thicker and thinner parts, part of the thinner part forming a high voltage lead; a semiconductor die attached to the thicker part; and a molding compound (MC) encapsulating the die. The thicker leadframe part is disposed at a bottom side...

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Bibliographische Detailangaben

Hauptverfasser:	Hoe, Tian See, Stoek, Thomas, Stiller, Bernhard, Niendorf, Michael, Koe, Kean Ming, Murugan, Sanjay Kumar, Keli, Elvis, Busch, Ludwig, Enverga, Angel, Nikitin, Ivan, Hiew, Mei Fen, Tean, Ke Yan, Kreiter, Oliver Markus
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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