WAFER CLEANING APPARATUS, METHOD FOR CLEANING WAFER AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

A wafer cleaning apparatus, a method of cleaning wafer and a method of fabricating a semiconductor device are provided. The method of fabricating the semiconductor device includes disposing a wafer on a rotatable chuck, irradiating a lower surface of the wafer with a laser to heat the wafer, and sup...

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Bibliographische Detailangaben
Hauptverfasser: JEANG, Eun Hee, JANG, Hun Jae, SHIN, Seung Min, EARMME, Tae Min, CHO, Seongkeun, KIM, Young Hoo, LEE, Kun Tack
Format: Patent
Sprache:eng
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