WAFER CLEANING APPARATUS, METHOD FOR CLEANING WAFER AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

A wafer cleaning apparatus, a method of cleaning wafer and a method of fabricating a semiconductor device are provided. The method of fabricating the semiconductor device includes disposing a wafer on a rotatable chuck, irradiating a lower surface of the wafer with a laser to heat the wafer, and sup...

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Hauptverfasser: JEANG, Eun Hee, JANG, Hun Jae, SHIN, Seung Min, EARMME, Tae Min, CHO, Seongkeun, KIM, Young Hoo, LEE, Kun Tack
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creator JEANG, Eun Hee
JANG, Hun Jae
SHIN, Seung Min
EARMME, Tae Min
CHO, Seongkeun
KIM, Young Hoo
LEE, Kun Tack
description A wafer cleaning apparatus, a method of cleaning wafer and a method of fabricating a semiconductor device are provided. The method of fabricating the semiconductor device includes disposing a wafer on a rotatable chuck, irradiating a lower surface of the wafer with a laser to heat the wafer, and supplying a chemical to an upper surface of the wafer to clean the wafer, wherein the laser penetrates an optical system including an aspheric lens array, the laser penetrates a calibration window, which includes a first window structure including a first light projection window including first and second regions different from each other, a first coating layer covering the first region of the first light projection window, and a second coating layer covering the second region of the first light projection window, and the first coating layer and the second coating layer have different light transmissivities from each other.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2022262621A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2022262621A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2022262621A13</originalsourceid><addsrcrecordid>eNrjZEgOd3RzDVJw9nF19PP0c1dwDAhwDHIMCQ3WUfB1DfHwd1Fw80eShqh29HNBlnVzdArydHYMASkIdvX1dPb3cwl1DgHKuLiGeTq78jCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSS-NBgIwMjIyMzIDR0NDQmThUAsCQ0xQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>WAFER CLEANING APPARATUS, METHOD FOR CLEANING WAFER AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE</title><source>esp@cenet</source><creator>JEANG, Eun Hee ; JANG, Hun Jae ; SHIN, Seung Min ; EARMME, Tae Min ; CHO, Seongkeun ; KIM, Young Hoo ; LEE, Kun Tack</creator><creatorcontrib>JEANG, Eun Hee ; JANG, Hun Jae ; SHIN, Seung Min ; EARMME, Tae Min ; CHO, Seongkeun ; KIM, Young Hoo ; LEE, Kun Tack</creatorcontrib><description>A wafer cleaning apparatus, a method of cleaning wafer and a method of fabricating a semiconductor device are provided. The method of fabricating the semiconductor device includes disposing a wafer on a rotatable chuck, irradiating a lower surface of the wafer with a laser to heat the wafer, and supplying a chemical to an upper surface of the wafer to clean the wafer, wherein the laser penetrates an optical system including an aspheric lens array, the laser penetrates a calibration window, which includes a first window structure including a first light projection window including first and second regions different from each other, a first coating layer covering the first region of the first light projection window, and a second coating layer covering the second region of the first light projection window, and the first coating layer and the second coating layer have different light transmissivities from each other.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CLEANING ; CLEANING IN GENERAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PERFORMING OPERATIONS ; PREVENTION OF FOULING IN GENERAL ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220818&amp;DB=EPODOC&amp;CC=US&amp;NR=2022262621A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220818&amp;DB=EPODOC&amp;CC=US&amp;NR=2022262621A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JEANG, Eun Hee</creatorcontrib><creatorcontrib>JANG, Hun Jae</creatorcontrib><creatorcontrib>SHIN, Seung Min</creatorcontrib><creatorcontrib>EARMME, Tae Min</creatorcontrib><creatorcontrib>CHO, Seongkeun</creatorcontrib><creatorcontrib>KIM, Young Hoo</creatorcontrib><creatorcontrib>LEE, Kun Tack</creatorcontrib><title>WAFER CLEANING APPARATUS, METHOD FOR CLEANING WAFER AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE</title><description>A wafer cleaning apparatus, a method of cleaning wafer and a method of fabricating a semiconductor device are provided. The method of fabricating the semiconductor device includes disposing a wafer on a rotatable chuck, irradiating a lower surface of the wafer with a laser to heat the wafer, and supplying a chemical to an upper surface of the wafer to clean the wafer, wherein the laser penetrates an optical system including an aspheric lens array, the laser penetrates a calibration window, which includes a first window structure including a first light projection window including first and second regions different from each other, a first coating layer covering the first region of the first light projection window, and a second coating layer covering the second region of the first light projection window, and the first coating layer and the second coating layer have different light transmissivities from each other.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLEANING</subject><subject>CLEANING IN GENERAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>PREVENTION OF FOULING IN GENERAL</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZEgOd3RzDVJw9nF19PP0c1dwDAhwDHIMCQ3WUfB1DfHwd1Fw80eShqh29HNBlnVzdArydHYMASkIdvX1dPb3cwl1DgHKuLiGeTq78jCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSS-NBgIwMjIyMzIDR0NDQmThUAsCQ0xQ</recordid><startdate>20220818</startdate><enddate>20220818</enddate><creator>JEANG, Eun Hee</creator><creator>JANG, Hun Jae</creator><creator>SHIN, Seung Min</creator><creator>EARMME, Tae Min</creator><creator>CHO, Seongkeun</creator><creator>KIM, Young Hoo</creator><creator>LEE, Kun Tack</creator><scope>EVB</scope></search><sort><creationdate>20220818</creationdate><title>WAFER CLEANING APPARATUS, METHOD FOR CLEANING WAFER AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE</title><author>JEANG, Eun Hee ; JANG, Hun Jae ; SHIN, Seung Min ; EARMME, Tae Min ; CHO, Seongkeun ; KIM, Young Hoo ; LEE, Kun Tack</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2022262621A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLEANING</topic><topic>CLEANING IN GENERAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>PREVENTION OF FOULING IN GENERAL</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>JEANG, Eun Hee</creatorcontrib><creatorcontrib>JANG, Hun Jae</creatorcontrib><creatorcontrib>SHIN, Seung Min</creatorcontrib><creatorcontrib>EARMME, Tae Min</creatorcontrib><creatorcontrib>CHO, Seongkeun</creatorcontrib><creatorcontrib>KIM, Young Hoo</creatorcontrib><creatorcontrib>LEE, Kun Tack</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JEANG, Eun Hee</au><au>JANG, Hun Jae</au><au>SHIN, Seung Min</au><au>EARMME, Tae Min</au><au>CHO, Seongkeun</au><au>KIM, Young Hoo</au><au>LEE, Kun Tack</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>WAFER CLEANING APPARATUS, METHOD FOR CLEANING WAFER AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE</title><date>2022-08-18</date><risdate>2022</risdate><abstract>A wafer cleaning apparatus, a method of cleaning wafer and a method of fabricating a semiconductor device are provided. The method of fabricating the semiconductor device includes disposing a wafer on a rotatable chuck, irradiating a lower surface of the wafer with a laser to heat the wafer, and supplying a chemical to an upper surface of the wafer to clean the wafer, wherein the laser penetrates an optical system including an aspheric lens array, the laser penetrates a calibration window, which includes a first window structure including a first light projection window including first and second regions different from each other, a first coating layer covering the first region of the first light projection window, and a second coating layer covering the second region of the first light projection window, and the first coating layer and the second coating layer have different light transmissivities from each other.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
title WAFER CLEANING APPARATUS, METHOD FOR CLEANING WAFER AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-05T12%3A48%3A42IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=JEANG,%20Eun%20Hee&rft.date=2022-08-18&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2022262621A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true