REINFORCED SEMICONDUCTOR DIE AND RELATED METHODS

REINFORCED SEMICONDUCTOR DIE AND RELATED METHODS

Implementations of methods of forming a plurality of reinforced die may include forming a plurality of die on a substrate and patterning a metal gang frame to form a plurality of metal plates. The plurality of metal plates may correspond to the plurality of die. The method may include coupling the m...

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Hauptverfasser: TOLENTINO, Erik Nino, KHOR, Swee Har, LIN, Yusheng, CHEW, Chee Hiong
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator TOLENTINO, Erik Nino
KHOR, Swee Har
LIN, Yusheng
CHEW, Chee Hiong
description Implementations of methods of forming a plurality of reinforced die may include forming a plurality of die on a substrate and patterning a metal gang frame to form a plurality of metal plates. The plurality of metal plates may correspond to the plurality of die. The method may include coupling the metal gang frame over the plurality of die and singulating the plurality of die. Each die of the plurality of die may include the corresponding metal plate from the plurality of metal plates coupled over the plurality of die.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title REINFORCED SEMICONDUCTOR DIE AND RELATED METHODS
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