SECURING POWER SEMICONDUCTOR COMPONENTS TO CURVED SURFACES

SECURING POWER SEMICONDUCTOR COMPONENTS TO CURVED SURFACES

The invention relates to an arrangement for a power converter (12) comprising at least one power module (1) comprising power semiconductor components (5) and a cooler (10), wherein the cooler (10) has a curved surface and the power module (1) is arranged on the surface and is connected in a positive...

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Hauptverfasser: Stegmeier, Stefan, Lasch, Markus, Müller, Claus, Raab, Oliver, Waltrich, Uwe
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Stegmeier, Stefan
Lasch, Markus
Müller, Claus
Raab, Oliver
Waltrich, Uwe
description The invention relates to an arrangement for a power converter (12) comprising at least one power module (1) comprising power semiconductor components (5) and a cooler (10), wherein the cooler (10) has a curved surface and the power module (1) is arranged on the surface and is connected in a positive fit to the cooler (10). The invention also relates to an associated manufacturing method as well as to a power converter with said type of arrangement and to a vehicle with a power converter.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SECURING POWER SEMICONDUCTOR COMPONENTS TO CURVED SURFACES
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