INSULATING COMPONENT, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR APPARATUS

An insulating component includes an insulating substrate, a metal layer, a bond, and a lead terminal. The plate-like insulating substrate has a groove continuous from its upper to side surfaces. The metal layer includes a first metal layer on the upper surface of the insulating substrate and a secon...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SAKUMOTO, Daisuke, JUTA, Masami
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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