LEAD FRAME, PACKAGED INTEGRATED CIRCUIT BOARD, POWER CHIP, AND CIRCUIT BOARD PACKAGING METHOD

Disclosed is a packaging solution, such as a lead frame for circuit board packaging, a packaged integrated circuit board, a power chip, and a circuit board packaging method. The lead frame includes a plurality of frame units disposed in parallel in a first direction. The frame unit includes a hollow...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FANG, Xuanwei, XIANG, Zhiqiang
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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