METAL LINES PATTERNED BY BOTTOM-UP FILL METALLIZATION FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION

Embodiments of the disclosure are in the field of integrated circuit structure fabrication. In an example, an integrated circuit structure includes a plurality of conductive interconnect lines above a substrate, individual ones of the conductive interconnect lines having a top and sidewalls. An etch...

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Bibliographische Detailangaben

Hauptverfasser:	CHEBIAM, Ramanan V, LIN, Kevin Lai, KOBRINSKY, Mauro, CARVER, Colin T
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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