NOVEL LGA ARCHITECTURE FOR IMPROVING RELIABILITY PERFORMANCE OF METAL DEFINED PADS

Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, an electronic package comprises a package substrate with a die side and a land side. In an embodiment, a pad is on the land side. In an embodiment, a dielectric layer covers si...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ARAKERE, Guruprasad, AHMED, Numair, GANESAN, Kousik, AGRAHARAM, Sairam, KULKARNI, Deepak, DUBEY, Manish, JEN, Wei-Lun K, JADHAV, Amol D, LEE, Kyu-Oh
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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