Conductive Interconnects and Methods of Forming Conductive Interconnects

Some embodiments include an integrated assembly having an interconnect over a first conductive structure and coupled with the first conductive structure. The interconnect includes a conductive core. The conductive core has a slender upper region and a wide lower region. The upper region joins to the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Kewley, David A, Ahmed, Raju, Lugani, Gurpreet, Speetjens, Frank, Pratt, Dave, Sung, Yung-Ta
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INFORMATION STORAGE PHYSICS SEMICONDUCTOR DEVICES STATIC STORES
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