SEMICONDUCTOR PACKAGE

A semiconductor package includes: a semiconductor chip having an active surface, on which a connection pad is disposed, and an inactive surface opposite to the active surface; a heat-dissipating member disposed on the inactive surface of the semiconductor chip and including graphite; an encapsulant...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KANG, Seungon, PARK, Seongchan, KWON, Sanghyun, LEE, Choonkeun, KIM, Han, KIM, Hyungkyu
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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