Joining Method

A method allows for firm joining of power module components even if a joining area is large. The method includes: forming an oxygen ion conductor layer on a surface of one of a first member to be joined containing metal and a second member to be joined containing ceramic and a metal plating layer on...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: Mihara, Teruyoshi
Format: Patent
Sprache:eng
Schlagworte:
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