DIE PICKUP DEVICE AND METHOD

DIE PICKUP DEVICE AND METHOD

The present invention provides a die pickup device and method. The die pickup device comprises: a carrier table, comprising a horizontal table surface configured to place dies; a pushing element arranged in the carrier table, which includes an ejector pin switchable between an extended state and a r...

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Hauptverfasser: ZHANG, Chunying, LIN, Chengchung, XUE, Xingtao
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator ZHANG, Chunying
LIN, Chengchung
XUE, Xingtao
description The present invention provides a die pickup device and method. The die pickup device comprises: a carrier table, comprising a horizontal table surface configured to place dies; a pushing element arranged in the carrier table, which includes an ejector pin switchable between an extended state and a retracted state in a direction vertical to the horizontal table surface, wherein when the ejector pin is in the extended state, the top of the ejector pin is higher than the horizontal table surface and can be kept fixed at a plurality of height positions; and a vacuum fixture configured to clamp the dies from the carrier table which is arranged above the carrier table. In the present invention, a die pickup device and process of large-scale chips are optimized and adjusted, thereby ensuring that the process of picking up dies of large-scale chips have a higher success rate; and through a multiple height lifting ejector pin design and adjusting the lifting height and retention duration of the ejector pin, the vacuum fixture can successfully pick up large-scale chip dies.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title DIE PICKUP DEVICE AND METHOD
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