PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTILAYER PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING MULTILAYER PRINTED WIRING BOARD
The present invention relates to provision of a photosensitive resin composition, a photosensitive resin composition for photo via formation, and a photosensitive resin composition for interlayer insulating layer, each of which is excellent in both photosensitive characteristics and strippability fr...
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| creator | NOMOTO, Shuji OKADE, Shota NAKAMURA, Akihiro TAKASE, Yuji SAWAMOTO, Hayato |
| description | The present invention relates to provision of a photosensitive resin composition, a photosensitive resin composition for photo via formation, and a photosensitive resin composition for interlayer insulating layer, each of which is excellent in both photosensitive characteristics and strippability from a support film. In addition, the present invention relates to provision of a photosensitive resin film and a photosensitive resin film for interlayer insulating layer, each of which is composed of the aforementioned photosensitive resin composition. Furthermore, the present invention relates to provision of a multilayer printed wiring board and a semiconductor package, and to provision of a method for producing the aforementioned multilayer printed wiring board. Specifically the photosensitive resin composition is a photosensitive resin composition containing (A) a photopolymerizable compound having an ethylenically unsaturated group, (B) a photopolymerization initiator, and (C) a thermosetting resin, wherein the photopolymerizable compound (A) having an ethylenically unsaturated group includes (A1) a photopolymerizable compound having an acidic substituent and an alicyclic structure together with an ethylenically unsaturated group; and further, the thermosetting resin (C) includes (C1) a thermosetting resin having an alicyclic structure, and the content of the component (C1) is 10 parts by mass or more based on 100 parts by mass of the component (A). |
| format | Patent |
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In addition, the present invention relates to provision of a photosensitive resin film and a photosensitive resin film for interlayer insulating layer, each of which is composed of the aforementioned photosensitive resin composition. Furthermore, the present invention relates to provision of a multilayer printed wiring board and a semiconductor package, and to provision of a method for producing the aforementioned multilayer printed wiring board. Specifically the photosensitive resin composition is a photosensitive resin composition containing (A) a photopolymerizable compound having an ethylenically unsaturated group, (B) a photopolymerization initiator, and (C) a thermosetting resin, wherein the photopolymerizable compound (A) having an ethylenically unsaturated group includes (A1) a photopolymerizable compound having an acidic substituent and an alicyclic structure together with an ethylenically unsaturated group; and further, the thermosetting resin (C) includes (C1) a thermosetting resin having an alicyclic structure, and the content of the component (C1) is 10 parts by mass or more based on 100 parts by mass of the component (A).</description><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CINEMATOGRAPHY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220519&DB=EPODOC&CC=US&NR=2022155681A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220519&DB=EPODOC&CC=US&NR=2022155681A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NOMOTO, Shuji</creatorcontrib><creatorcontrib>OKADE, Shota</creatorcontrib><creatorcontrib>NAKAMURA, Akihiro</creatorcontrib><creatorcontrib>TAKASE, Yuji</creatorcontrib><creatorcontrib>SAWAMOTO, Hayato</creatorcontrib><title>PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTILAYER PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING MULTILAYER PRINTED WIRING BOARD</title><description>The present invention relates to provision of a photosensitive resin composition, a photosensitive resin composition for photo via formation, and a photosensitive resin composition for interlayer insulating layer, each of which is excellent in both photosensitive characteristics and strippability from a support film. 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In addition, the present invention relates to provision of a photosensitive resin film and a photosensitive resin film for interlayer insulating layer, each of which is composed of the aforementioned photosensitive resin composition. Furthermore, the present invention relates to provision of a multilayer printed wiring board and a semiconductor package, and to provision of a method for producing the aforementioned multilayer printed wiring board. Specifically the photosensitive resin composition is a photosensitive resin composition containing (A) a photopolymerizable compound having an ethylenically unsaturated group, (B) a photopolymerization initiator, and (C) a thermosetting resin, wherein the photopolymerizable compound (A) having an ethylenically unsaturated group includes (A1) a photopolymerizable compound having an acidic substituent and an alicyclic structure together with an ethylenically unsaturated group; and further, the thermosetting resin (C) includes (C1) a thermosetting resin having an alicyclic structure, and the content of the component (C1) is 10 parts by mass or more based on 100 parts by mass of the component (A).</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTILAYER PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING MULTILAYER PRINTED WIRING BOARD |
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