THERMALLY EXPANDABLE MICROCAPSULES AND FOAM MOLDING COMPOSITION

The present invention provides a thermally expandable microcapsule having excellent heat resistance and high expansion ratio and enabling production of a light, high-hardness molded article having excellent physical properties (abrasion resistance), and a composition for foam molding containing the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KAWAKAMI, Takeru, KAWAGUCHI, Yasuhiro, SATOU, Shun
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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