System and Method for Die Crack Detection in a CMOS Bonded Array

A system and method for die crack detection in a CMOS bonded array includes a capacitor that is formed in an edge seal, where one of the capacitor plates is in the edge seal portion of a first wafer, and the other capacitor plate is in the edge seal portion of a second wafer. A crack in the die can...

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Hauptverfasser: Pachamuthu, Jayavel, Linnen, Daniel, Periyannan, Kirubakaran
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creator Pachamuthu, Jayavel
Linnen, Daniel
Periyannan, Kirubakaran
description A system and method for die crack detection in a CMOS bonded array includes a capacitor that is formed in an edge seal, where one of the capacitor plates is in the edge seal portion of a first wafer, and the other capacitor plate is in the edge seal portion of a second wafer. A crack in the die can be detected by applying an alternating current waveform to a testing contact on the integrated circuit and monitoring for a shift in the alternating current waveform, as a crack would cause modulation in the capacitance.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
title System and Method for Die Crack Detection in a CMOS Bonded Array
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