DRY ETCH BACK SUBSTRATE INTERCONNECTIONS

A method of forming electrical interconnections comprises patterning a trace on a dielectric layer and then masking the dielectric layer for plating. The dielectric layer is plated to form electrical interconnections. After plating the masking is removed. A laser etch back of the trace is performed...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KANG, Kuiwon, TONG, Jialing, BUOT, Joan Rey Villarba
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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