RELIABLE SEMICONDUCTOR PACKAGES

RELIABLE SEMICONDUCTOR PACKAGES

A semiconductor package and a method of manufacturing thereof is disclosed. The package includes a package substrate having a die attach region with a die attached thereto. A protective cover with a cover adhesive is disposed over a sensor region of the die and attached to the die by the cover adhes...

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Hauptverfasser: Punzalan, Jeffrey, SHIM, IL KWON
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Punzalan, Jeffrey
SHIM, IL KWON
description A semiconductor package and a method of manufacturing thereof is disclosed. The package includes a package substrate having a die attach region with a die attached thereto. A protective cover with a cover adhesive is disposed over a sensor region of the die and attached to the die by the cover adhesive. The cover adhesive is disposed in a cap bonding region of the protective cover.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title RELIABLE SEMICONDUCTOR PACKAGES
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