System and Method for Warpage Detection in a CMOS Bonded Array

A system and method for warpage detection in a CMOS bonded array includes a conductor positioned between bonded contact pads of first and second wafers. The conductor is connected to a continuity check circuit. If the continuity check circuit detects an interruption in conductivity of the conductor,...

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Bibliographische Detailangaben

Hauptverfasser:	Pachamuthu, Jayavel, Linnen, Daniel, Periyannan, Kirubakaran
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS SEMICONDUCTOR DEVICES TESTING
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