System and Method for Warpage Detection in a CMOS Bonded Array

System and Method for Warpage Detection in a CMOS Bonded Array

A system and method for warpage detection in a CMOS bonded array includes a conductor positioned between bonded contact pads of first and second wafers. The conductor is connected to a continuity check circuit. If the continuity check circuit detects an interruption in conductivity of the conductor,...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Pachamuthu, Jayavel, Linnen, Daniel, Periyannan, Kirubakaran
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Beschreibung
Zusammenfassung:A system and method for warpage detection in a CMOS bonded array includes a conductor positioned between bonded contact pads of first and second wafers. The conductor is connected to a continuity check circuit. If the continuity check circuit detects an interruption in conductivity of the conductor, such interruption is indicative of warpage in the first and/or second wafers. In one implementation, the conductor is a serpentine-shaped structure.