HIGH BREAKING CAPACITY CHIP FUSE

A high breaking capacity chip fuse including a bottom insulative layer, a first intermediate insulative layer, a second intermediate insulative layer, and a top insulative layer disposed in a stacked arrangement in the aforementioned order, a fusible element disposed between the first and second int...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Santos, Irma Valeriano, Dietsch, G. Todd
Format: Patent
Sprache:eng
Schlagworte:
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