SEMICONDUCTOR PACKAGE

A semiconductor package including a substrate including at least one ground pad and a ground pattern; a semiconductor chip on the substrate; and a shield layer on the substrate and covering the semiconductor chip, wherein the shield layer extends onto a bottom surface of the substrate and includes a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM, Jongwan, LEE, Yongkwan, KOH, Kyong Hwan, OH, Juhyeon
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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