SEMICONDUCTOR PACKAGE

A semiconductor package includes a redistribution substrate including a first redistribution layer; a semiconductor chip electrically connected to the first redistribution layer; a vertical connection structure adjacent a periphery of the semiconductor chip and electrically connected to the first re...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Ko, Youngchan, Kang, Myungsam, Cho, Bongju, Kim, Jeongseok, Mun, Kyungdon, Kwon, Yieok, Lee, Gongje
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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