RADIATION BOARD

The objective of the present invention is to provide a radiation board, which has a low thermal expansion coefficient so as to prevent bending or damage caused by a difference in thermal deformation during bonding to a ceramic material (particularly, alumina), has high thermal conductivity in the thickness direction of the board so as to be applicable to a chip of a high power element such as a power transistor having hundreds of watts, and prevents a problem, such as a finishing defect, during a plating process performed while an electronic element is mounted.The radiation board according to the present invention comprises: a core layer having metal and nonmetal materials; a first cover layer for covering upper and lower surfaces of the core layer; and a second cover layer for covering at least some side surfaces of the core layer, wherein the first cover layer and the second cover layer are made of a material that can be plated on externally exposed surfaces thereof.