EMBEDDED AND DISTRIBUTED INDUCTIVE DEVICES

An electronic package comprises an integrated circuit (IC) configured to receive a power input signal and to deliver a regulated power output signal. A multilayer electrical routing structure is attached to the IC and is configured to couple the electronic package to an external circuit. The multila...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Antunes Bezerra, Alexandre, Der Minassians, Artin
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDUCTANCES MAGNETS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES SEMICONDUCTOR DEVICES TRANSFORMERS
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